Environmental Frequently Asked Questions (FAQ)
Does SST offer Non-Pb (Lead-Free) products?
How do I identify SST's Non-Pb (Lead-Free) products?
What do the SST Environmental Attributes in the package field code, "E" and "F", mean?
What is the composition of SST's non-Pb (lead-free) packages?
What is RoHS?
Are SST's products RoHS compliant?
What substances are not included in SST's non-Pb (lead-free) products?
Are the solder reflow profiles for leaded and lead-free devices the same?
What is the recommended peak reflow temperature for SST's non-Pb (lead-free) parts?
What is the absolute maximum peak reflow temperature for SST's non-Pb (lead-free) parts?
Does SST offer Non-Pb (Lead-Free) products?
All members of SST's Parallel Flash, Serial Flash, Combination Memory, Embedded Controllers and Mass Storage product lines are offered with a non-Pb (lead-free) environmental option. All of SST's lead-free products are RoHS compliant. In the future, SST will aim to offer non-Pb products in its Emosyn and communications product lines.
How do I identify SST's Non-Pb (Lead-Free) products?
SST's environmentally friendly parts have a package field code (i.e. Environmental Attribute) ending with the letter “E” or “F”. For example, the part number SST39VF020-70-4C-WHE has a package field of “WHE”, where “E” indicates it is a non-Pb (Lead-Free) part. The code is marked clearly on each package, as well as on all shipping materials and invoices.
See our list of Non-Pb (Lead Free) parts or the corresponding datasheet for additional information.
What do the SST Environmental Attributes in the package field code, "E" and "F", mean?
Environmental suffix "E" denotes non-Pb (lead-free) solder that is Sn (tin) based. Environmental suffix "F" denotes non-Pb/non-Sn (lead-free / tin-free) solder.
What is the composition of SST's non-Pb (lead-free) packages?
Devices with environmental suffix "E"
- Lead-frame based -- Pure matte Sn (tin)
- Laminate substrate based -- Sn/Ag 4%/Cu 0.5%
Devices with environmental suffix "F"
- Lead-frame based -- NiPdAu (Nickel, Palladium, Gold)
- Laminated substrate based -- NiAu (Nickel, Gold)
SST lead-frame packages are PDIP, PLCC, SOIC, TQFP, TSOP, WSON*
SST laminated substrate based packages are LFBGA, TFBGA, WFBGA, XFLGA, WSON*
* Clarification for SST's WSON packages: SST package type "QA*" is a lead-frame one.
SST package type "MA*" is a laminated substrate based one.
What is RoHS?
RoHS (Restriction on Hazardous Substances) is a European Union (EU) directive that bans lead (Pb) and other certain materials in electrical and electronic equipment. This directive takes effect on July 1, 2006.
The RoHS directive bans the following substances:
- Lead and it’s compounds
- Mercury and it’s compounds
- Cadmium or cadmium compounds
- Hexavalent Chromium and it’s compounds
- PBB (polybromobiphenyl)
- PBDE (polybrominated diphenyl ethers)
Are SST's products RoHS compliant?
SST's non-Pb (lead-free) products (denoted with Environmental Attribute "E" or "F")
are RoHS compliant. See SST's
Certification of Non-Use of Hazardous Substances for more information.
What substances are not included in SST's non-Pb (lead-free) products?
In accordance with RoHS, WEEE and other internationally recognized standards, substances listed below are not included in any SST products marked “E” or “F”, manufactured by SST‘s approved subcontractors and delivered by SST or from SST authorized distribution sources. In addition, the substances are not included in any package or packing material used for delivery of the products.
Abbreviated List of banned substances
- Lead and it’s compounds
- Mercury and it’s compounds
- Cadmium or cadmium compounds
- Hexavalent Chromium and it’s compounds
- PBB (polybromobiphenyl)
- PBDE (polybrominated diphenyl ethers)
- Chlorinated paraffins (chlorine flame retarding materials/plasticizers)
- Polychlorinated biphenyl (PCB) category
- Polychlorinated naphthalene category
- Organic Tin compounds (Tributhyl tin category/Triphenyl tin category)
- Asbestos
- Azo compounds
- CFCs or other Class 1 Ozone Depleting Substances
This list is only an abbreviated one. If you need more information concerning SST products and a specific substance, please contact your local SST sales office.
Are the solder reflow profiles for leaded and lead-free devices the same?
The solder reflow profiles for Pb (leaded) and non-Pb (lead-free) devices are not the same.
What is the recommended peak reflow temperature for SST's non-Pb (lead-free) parts?
SST recommends using a peak reflow temperature of 245º C (+5/-0º C) for up to 10 seconds. 245° C (+5/-0° C) is also recommended by industry joint standard JEDEC/IPC JSTD-020B. For customers requiring wider temperature range allowance, we suggest 245° C (+10/-5° C).
What is the absolute maximum peak reflow temperature for SST's non-Pb (lead-free) parts?
SST's maximum peak reflow temperature for qualification is 260º C. However, lower temperature can be used and is recommended to put less stress on packages. This is consistent with popular industry recommendations.
Also note that package solder melting point is 227º C to 232º C depending on composition of solder of the unit. Ideal wetting conditions may require exposure several seconds above that temperature.
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